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产品名称

GT1020

PTFE High Frequency Copper-Clad-Laminate

发布时间 2017-08-23
点击次数 47
GT1020
产品名称:

GT1020

上市日期: 2017-08-23

Main Features

• High Dielectric Constant

• Miniaturization RF Device

• High Thermal Conductivity

• Satellite Communications Device

• Excellent Machining Property

• Mini type Power Amplifier, Filter


Product Overview

8-ChMPEG-2/H.264标清编码器

G-T1020 copper-clad-laminate (CCL) composed with PTFE and special enforcement by special glass fiber, which can provide excellent electricity and mechanical stability. It is a kind of special microwave high dielectric constant circuit board material which can carry out a lot of information processing under UHF (GHz). Its high Dk and low Df can meet the performance of the design, which is applicable to the circuit miniaturization, the heat dissipation treatment and so on. Combined with glass fabric, the lamination surface is smooth that PTFE can use the standard PTFE printed circuit board to process the treatment technologies.


Technical Specifications

8-ChMPEG-2/H.264标清编码器

Physical

Standard Thickness

Standard Size

Standard Copper Foil

0.127mm (0.005”)

1220mm x 914mm (48 x 36)

18μm (½ oz.), HTE (H/H)

0.254mm (0.010”)

610mm x 457mm (24 x 18)

18μm (1 oz.), HTE (H/H)

0.635mm (0.025”)

457mm x 305mm (18 x 12)

18μm (½ oz.), RTF (H/H)

1.270mm (0.050”)


35μm (1 oz.), RTF (1/1)


Test Performance

Test Parameters

Typical Value

Unit

Treatment Condition

Test

Method


GT1020




DK

10.2±0.05

-

10 GHz/23℃

IPC-TM-650 2.5.5.5

DF

0.0035





0.0045

-

10 GHz/23℃

IPC-TM-650 2.5.5.5

Temperature Coefficient of Dk

-459

ppm/℃

-50 to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.8x105

MΩ*cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

2.3x105

COND A

IPC-TM-650 2.5.17.Q

Tensile Strength

240

Mpa(kpsi)

RT

ASTM D638


34




Bending Strength

293

Mpa(kpsi)


IPC-TM-650 2.4.4


42




Dimensional Stability

<0.3

mm/m


IPC-TM-650 2.4.39A

CTE

13/13/17

ppm/℃

-55 to 288℃

IPC-TM-650 2.4.41

TD

500



ASTM D3850

Thermal Conductivity

0.9

W/m/K

80℃ 

ASTM C518

Water Absorption

<0.10

%

D24/23

ASTM D570

Density

2.8

gm/cm3

23℃

ASTM D792

Typical Peel Strength

>1.4

N/mm

Hoz

IPC-TM-650 2.4.8

Flammability Rating

V-0



UL 94

Lead-Free Process Compatible

Yes





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