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产品名称

GT1350

PTFE High Frequency Copper-Clad-LaminateProduct Overview

发布时间 2017-08-23
点击次数 28
GT1350
产品名称:

GT1350

上市日期: 2017-08-23

Main Features

• Good Thermostability

• High Power RF and Microwave Amplifier

• Low Dielectric Constant

• Wireless Communication System

• Excellent Machining Performance

• Power Amplifier    



Product Overview

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GT1350 high frequency circuit material is a product of special enforcement by glass fibre composed with PTFE, which can provide excellent electricity and mechanical stability. It is a kind of high dielectric constant circuit board material which can carry out a lot of information processing under UHF (GHz).It is an ideal material for RF and Microwave application areas. Dielectric constant is 3.5, dissipation factor is 0.0040, which can meet the performance of the design. Combined with glass fabric, the lamination surface is smooth that PTFE can use the standard PTFE printed circuit board to process the treatment technologies.


Technical Specifications

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Physical

standard thickness

standard size

standard copper foil

0.005〞(0.127mm)

48 X 36 (1220mm*914mm)

½ oz. (18μm)  HTE (H/H)

0.010〞(0.254mm)

24 X 18 (610mm*457mm)

1 oz. (18μm)  HTE (H/H)

0.025〞(0.635mm)

18 X 12 (457mm*305mm)

½ oz. (18μm)  RTF (H/H)

0.050〞(1.270mm)


1 oz. (35μm)  RTF (1/1)



Test Performance

Performance

Typical Value

Direction

Unit

Treatment Condition

Test

 Method

GT1350





DK

3.5±0.05

Z

-

10 GHz/23℃

IPC-TM-650 2.5.5.5

DF

0.003





0.004

Z

-

10 GHz/23℃

IPC-TM-650 2.5.5.5

Temperature coefficient of Dk

-55

Z

ppm/℃

-50 -- 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.2*105

XY

MΩ*cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

2.0*105


COND A

IPC-TM-650 2.5.17.Q

Tensile Strength

212


Mpa(kpsi)

RT

ASTM D638


30





Bending Strength

278


Mpa(kpsi)


IPC-TM-650 2.4.4


39





Dimensional Stability

<0.5


mm/m


IPC-TM-650 2.4.39A

CTE

18/19/24

X/Y/Z

ppm/℃

-55 -- 288℃

IPC-TM-650 2.4.41

TD

500




ASTM D3850

Thermal Conductivty

0.8

-

W/m/K

80℃ 

ASTM C518

Water Absorptio

<0.10


%

D24/23

ASTM D570

Density

2.2


gm/cm3

23℃

ASTM D792

Typical Peel Strength

>1.4


N/mm

H oz

IPC-TM-650 2.4.8

Flammability Rating

V-0




UL 94

Lead-Free Process Compatible

Yes





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