Main Features
• High Dielectric Constant
• Miniaturization RF Device
• High Thermal Conductivity
• Satellite Communications Device
• Excellent Machining Property
• Mini type Power Amplifier, Filter
Product Overview
G-T1020 copper-clad-laminate (CCL) composed with PTFE and special enforcement by special glass fiber, which can provide excellent electricity and mechanical stability. It is a kind of special microwave high dielectric constant circuit board material which can carry out a lot of information processing under UHF (GHz). Its high Dk and low Df can meet the performance of the design, which is applicable to the circuit miniaturization, the heat dissipation treatment and so on. Combined with glass fabric, the lamination surface is smooth that PTFE can use the standard PTFE printed circuit board to process the treatment technologies.
Technical Specifications
Physical
Standard Thickness
Standard Size
Standard Copper Foil
0.127mm (0.005”)
1220mm x 914mm (48 x 36)
18μm (½ oz.), HTE (H/H)
0.254mm (0.010”)
610mm x 457mm (24 x 18)
18μm (1 oz.), HTE (H/H)
0.635mm (0.025”)
457mm x 305mm (18 x 12)
18μm (½ oz.), RTF (H/H)
1.270mm (0.050”)
35μm (1 oz.), RTF (1/1)
Test Performance
Test Parameters
Typical Value
Unit
Treatment Condition
Test
Method
GT1020
DK
10.2±0.05
-
10 GHz/23℃
IPC-TM-650 2.5.5.5
DF
0.0035
0.0045
Temperature Coefficient of Dk
-459
ppm/℃
-50 to 150℃
Volume Resistivity
1.8x105
MΩ*cm
COND A
IPC-TM-650 2.5.17.1
Surface Resistivity
2.3x105
MΩ
IPC-TM-650 2.5.17.Q
Tensile Strength
240
Mpa(kpsi)
RT
ASTM D638
34
Bending Strength
293
IPC-TM-650 2.4.4
42
Dimensional Stability
<0.3
mm/m
IPC-TM-650 2.4.39A
CTE
13/13/17
-55 to 288℃
IPC-TM-650 2.4.41
TD
500
ASTM D3850
Thermal Conductivity
0.9
W/m/K
80℃
ASTM C518
Water Absorption
<0.10
%
D24/23
ASTM D570
Density
2.8
gm/cm3
23℃
ASTM D792
Typical Peel Strength
>1.4
N/mm
Hoz
IPC-TM-650 2.4.8
Flammability Rating
V-0
UL 94
Lead-Free Process Compatible
Yes